sep 2026 to now
/ education/ London, UKMSc Artificial Intelligence for Biomedicine & Healthcare
University College London (UCL)
Straight to the point? Check the simple version here.
I build AI systems for medicine and rehabilitation. I'm currently doing an MSc in AI for Biomedicine and Healthcare at UCL, after medical AI at Arkangel, e-commerce at Promart, and seven years of robotics research.
now → 2017
From an MSc in London back to the robotics lab in Lima where it started.
sep 2026 to now
/ education/ London, UKUniversity College London (UCL)
nov 2024 to sep 2026
/ workapr 2024 to oct 2024
/ work/ Lima, PeruIndigital XP · Intercorp Retail (Promart)
mar 2017 to aug 2022
/ education/ Lima, PeruUniversidad de Ingeniería y Tecnología (UTEC)
UTEC · advisor: Deyby Huamanchahua
UTEC · advisor: Jimmy Tarrillo
UTEC · advisor: Christian Flores
UTEC & Purdue University · advisor: Ruth Canahuire
UTEC · advisor: Ruth Canahuire & Joseph Campion
peer-reviewed & preprints
11 papers · 2018 to 2026
Research Square preprint · E. R. Escandón, K. Monsalve, F. Ramírez, J. Zea, N. Castaño-Villegas, L. Velásquez
Research Square preprint · K. Monsalve, N. Castaño-Villegas, F. Ramírez, E. R. Escandón, J. Zea, L. Velásquez
JMIR Preprints · N. Castaño-Villegas, E. R. Escandón, K. Monsalve, J. Zea, L. Velásquez
medRxiv · K. Monsalve, N. Castano-Villegas, E. Escandón, J. Zea, L. Velásquez
IEMTRONICS 2024, Springer · D. Huamanchahua, R. Escandón-Tufino, S. Loayza-Bautista, et al.
IEMTRONICS 2024, Springer · D. Huamanchahua, R. Escandón-Tufino, R. Aique, C. Vasquez, et al.
Applied Soft Computing, vol. 117, p. 108359 · C.F. Vega, J. Quevedo, E. Escandón, M. Kiani, W. Ding, J. Andreu-Perez
Brazilian Technology Symposium, pp. 870-877, Springer · E. Escandón, C. Flores
IEEE Engineering International Research Conference (EIRCON), pp. 1-4 · E.R. Escandón, C. Flores
IEEE XXVI International Conference on Electronics, Electrical Engineering and Computing (INTERCON), pp. 1-4 · F. García-Cárdenas, E. Escandón, R. Canahuire
IEEE XXV International Conference on Electronics, Electrical Engineering and Computing (INTERCON), pp. 1-4 · E.R. Escandon, J. Campion